Electronics Innovation: Ultra-Thin Molded Parts with Integrated Circuits Shrink Smartwatch Sizes by 20%
Molded parts often integrate features (e.g., snaps, threads) to simplify assembly, reducing the need for additional fasteners in products like laptop casings.

Table of Contents
1. Introduction: The Urgency of Smartwatch Miniaturization
2. What Are Ultra-Thin Molded Parts? Definition and Core Characteristics
2.1 Definition
2.2 Core Characteristics
- Extreme Thinness: With thicknesses as low as 0.1mm, they occupy 50-80% less space than traditional parts. For example, a conventional smartwatch circuit board substrate (2.0mm thick) can be replaced by an ultra-thin molded part (0.5mm thick), saving 75% of vertical space.
- High Structural Integrity: Despite their thinness, these parts maintain high tensile strength (≥50 MPa) and impact resistance (≥20 kJ/m²) thanks to advanced materials and manufacturing techniques. This is critical for smartwatches, which are prone to drops and daily wear.
- Design Flexibility: They can be molded into complex shapes (e.g., curved surfaces, micro-channels for heat dissipation, tiny holes for sensor access) that match the ergonomic contours of smartwatch casings. This eliminates the need for additional adapters or spacers, further reducing size.
- Electrical Compatibility: Unlike standard molded parts (which may interfere with electrical signals), ultra-thin molded parts are engineered to have low dielectric constant (εr ≤ 3.0) and low loss tangent (tanδ ≤ 0.001), ensuring they do not disrupt IC performance or sensor accuracy.
3. Materials of Ultra-Thin Molded Parts: Balancing Thinness, Strength, and Compatibility
3.1 Polymer Composite Materials (The Most Widely Used)
- Glass Fiber-Reinforced Polyamide (PA-GF): PA (nylon) is inherently lightweight and flexible, while adding 10-30% glass fiber boosts tensile strength to 60-80 MPa—enough to support ICs and sensors. PA-GF also has good heat resistance (continuous use temperature: 120-150°C), which is critical for smartwatches that generate heat during charging or heavy use. Brands like Apple use PA-GF40 (40% glass fiber) for their molded circuit carriers.
- Carbon Fiber-Reinforced Polyetheretherketone (PEEK-CF): For high-end smartwatches (e.g., Garmin’s Fenix series, which targets outdoor enthusiasts), PEEK-CF is preferred. PEEK has excellent chemical resistance (resistant to sweat, oils, and UV rays) and a high continuous use temperature (250°C), while carbon fiber reduces weight by 15-20% compared to PA-GF. However, PEEK-CF is more expensive (≈\(50/kg vs. \)10/kg for PA-GF), limiting its use to premium models.
- Liquid Crystal Polymer (LCP): LCP is a specialty polymer with unique properties: it has ultra-low dielectric constant (εr = 2.8) and low moisture absorption (<0.1%), making it ideal for parts that directly contact ICs. LCP can also be molded into parts as thin as 0.05mm—thinner than a human hair. Samsung uses LCP for the molded carriers of its Galaxy Watch’s ECG sensors.
3.2 Ceramic-Based Materials (For High-Performance Applications)
- Alumina Ceramic (Al₂O₃): Alumina ceramic has a tensile strength of 300 MPa (6x higher than PA-GF) and a thermal conductivity of 30 W/m·K (10x higher than LCP). It is also biocompatible, making it suitable for medical-grade smartwatches (e.g., those used for continuous glucose monitoring). However, alumina ceramic is brittle and requires specialized molding processes (e.g., tape casting), increasing production costs. Companies like Corning have developed ultra-thin alumina ceramic parts (0.2mm thick) for medical wearables.
3.3 Metal-Polymer Hybrids (For Electrical Conductivity)
4. Manufacturing Processes of Ultra-Thin Molded Parts: Precision Engineering for Miniaturization
4.1 Micro-Injection Molding (For Polymer Composites)
- Precision Equipment: Micro-injection molding machines use screws with diameters as small as 12mm (vs. 20-30mm for traditional machines) to inject small volumes of molten polymer (0.1-1.0 cm³) into micro-molds. Machines like Engel’s e-mac 110/35 have position accuracy of ±0.001mm, ensuring consistent part thickness.
- Micro-Mold Design: Molds for ultra-thin parts are made from high-hardness steel (e.g., H13) with micro-sized cavities (as small as 0.05mm in depth). To prevent the molten polymer from cooling too quickly (which causes defects like warping), molds are heated to 150-200°C (higher than traditional molds) and use conformal cooling channels (3D-printed channels that follow the mold’s shape) for uniform temperature control.
- Process Control: The injection speed is slowed to 1-5 mm/s (vs. 10-50 mm/s for traditional molding) to avoid air bubbles, which are catastrophic for ultra-thin parts (they weaken the structure and disrupt electrical signals). Post-molding, parts are cured at 80-120°C for 2-4 hours to reduce residual stress and improve dimensional stability.
4.2 Tape Casting (For Ceramic-Based Parts)
- Slurry Preparation: Ceramic powder (e.g., Al₂O₃) is mixed with a binder (e.g., polyvinyl butyral) and solvent (e.g., ethanol) to create a homogeneous slurry with a viscosity of 500-1000 cP.
- Tape Casting: The slurry is poured onto a moving plastic film (e.g., PET) and spread into a thin layer using a doctor blade (a sharp tool with a gap of 0.05-0.2mm). The film moves through a drying oven (60-80°C) to evaporate the solvent, forming a flexible ceramic tape.
- Punching and Shaping: The ceramic tape is punched into the desired shape (e.g., a circular carrier for ICs) using precision dies with tolerances of ±0.005mm.
- Sintering: The shaped tape is heated to 1600-1700°C in a sintering furnace to densify the ceramic (reducing porosity to <1%) and increase strength. Post-sintering, the part is polished to achieve a smooth surface (Ra < 0.1 μm) that ensures good contact with ICs.
4.3 3D Printing (For Customized or Low-Volume Parts)
- Stereolithography (SLA): SLA uses a UV laser to cure liquid photopolymer resin into thin layers (0.025-0.1mm thick). It can produce parts with complex shapes (e.g., curved carriers with micro-channels) and tight tolerances (±0.01mm). However, SLA parts have lower strength (tensile strength: 30-40 MPa) than injection-molded parts, so they are mostly used for prototyping.
- Selective Laser Sintering (SLS): SLS uses a laser to sinter polymer powder (e.g., PA12) into parts. It can produce parts as thin as 0.1mm with higher strength (tensile strength: 50-60 MPa) than SLA, making it suitable for low-volume production (≈100 parts per day). Garmin used SLS to prototype ultra-thin molded parts for its Epix 2 smartwatch before switching to micro-injection molding for mass production.
5. Integration of Ultra-Thin Molded Parts with Integrated Circuits (ICs): The Key to Size Reduction
5.1 Integration Methods: Embedded vs. Surface-Mounted
5.1.1 Embedded Integration (Most Space-Efficient)
- IC Placement: Small IC chips (e.g., a 3mm x 3mm microcontroller) are placed in the micro-mold’s cavity using a robotic arm with vacuum tweezers (position accuracy: ±0.002mm).
- Polymer Injection: Molten polymer (e.g., LCP) is injected into the mold at low pressure (5-10 MPa) to avoid damaging the IC. The polymer flows around the IC, covering all sides except the contact pads (which are left exposed for later soldering).
- Post-Molding Processing: The part is removed from the mold and undergoes plasma cleaning to remove any polymer residue from the IC’s contact pads. A thin layer of solder paste (10-20 μm thick) is applied to the pads, and the part is heated to 220-250°C to reflow the solder—preparing it for connection to other components (e.g., sensors).
5.1.2 Surface-Mounted Integration (More Flexible)
- Pad Preparation: The molded part’s surface is coated with a thin layer of copper (5-10 μm thick) using electroless plating. The copper is etched into contact pads that match the IC’s pin layout.
- IC Attachment: The IC is placed on the contact pads using a pick-and-place machine (accuracy: ±0.005mm). Solder paste is applied between the IC’s pins and the pads, and the part is heated to 220-250°C to form a secure electrical connection.
- Encapsulation: A thin layer of epoxy resin (0.05-0.1mm thick) is applied over the IC to protect it from moisture and physical damage. The epoxy is cured at 80-100°C for 1 hour.
5.2 Key Challenges in Integration and Solutions
5.2.1 Thermal Compatibility
- Use thermally conductive materials: Molded parts made from PEEK-CF (thermal conductivity: 15 W/m·K) or metal-polymer hybrids (30 W/m·K) dissipate heat 5-10x faster than standard PA-GF parts.
- Design micro-channels: Ultra-thin molded parts can be molded with tiny channels (0.1mm wide) that allow air or liquid coolant to flow through, reducing temperature by 10-15°C. Apple’s Watch Series 10 uses this design for its S10 SiP (System-in-Package) IC.
5.2.2 Dimensional Mismatch
- Use low-shrinkage materials: LCP has a shrinkage rate of 0.2-0.3% (half that of PA-GF), reducing dimensional mismatch.
- Optimize cooling: Conformal cooling channels in molds ensure uniform cooling, minimizing warpage. Post-molding annealing (heating the part to 100-120°C for 2 hours) further reduces residual stress and shrinkage.
5.2.3 Electrical Interference
- Add a shielding layer: A thin layer of aluminum (5-10 μm thick) is deposited on the molded part’s surface using physical vapor deposition (PVD). This layer acts as an electromagnetic shield, blocking interference.
- Use non-conductive materials: For parts near sensitive ICs (e.g., GPS modules), non-conductive materials like LCP or alumina ceramic are used to avoid interference.
6. Application in Smartwatches: How Molded Parts Achieve 20% Size Shrinkage
6.1 Circuit Board Substrates: The Biggest Space Saver
- The PCB is replaced by an LCP-based molded part (0.5mm thick, 25mm x 20mm in size, 2g weight) that embeds the main IC, Bluetooth module, and battery management IC.
- No spacers are needed because the molded part is designed to fit directly into the casing’s contours.
- Space Saved: 75% (thickness) + 33% (area) = 54% total space reduction for the substrate.
6.2 Sensor Housings: Integrating Protection and Functionality
- All sensors are integrated into a single PA-GF40 molded part (0.3mm thick, 15mm x 10mm in size) that acts as both housing and electrical carrier.
- The molded part has built-in micro-channels for sensor access (e.g., a 0.1mm hole for the heart rate sensor’s LED) and embedded copper pads for direct connection to the main IC.
- Space Saved: 80% (thickness) + 67% (area) = 73% total space reduction for sensor housings.
6.3 Battery Covers: Combining Thickness Reduction and Durability
- The battery cover is replaced by a PEEK-CF molded part (0.4mm thick) that is both lightweight (1g vs. 3g for steel) and durable (resistant to scratches and impacts).
- The molded part has a built-in seal (molded into the design) that eliminates the need for a rubber gasket.
- Space Saved: 60% (thickness) + 100% (gasket space) = 80% total space reduction for the battery cover.
6.4 Total Size Reduction Calculation
- Traditional smartwatch: 12mm thickness, 42mm diameter, volume = π*(21mm)²*12mm ≈ 16,625 mm³.
- With ultra-thin molded parts: 9.6mm thickness, 38mm diameter, volume = π*(19mm)²*9.6mm ≈ 13,300 mm³.
- Reduction: (16,625 - 13,300)/16,625 ≈ 20%.
7. Performance Enhancements Beyond Size: Durability, Heat Dissipation, and Cost Efficiency
7.1 Durability: Withstanding Daily Wear and Tear
- Material Strength: PA-GF40 molded parts have a tensile strength of 80 MPa (2x higher than traditional PCBs) and an impact resistance of 25 kJ/m² (3x higher than plastic sensor housings). This reduces drop-related damage by 40-50%.
- Seamless Design: By integrating multiple components into a single molded part, there are fewer seams or connectors—points where moisture or dust can enter. For example, a traditional smartwatch has 10-15 seams (between PCB, sensor housings, and battery cover), while a molded part design has only 2-3. This reduces water damage by 60-70%.
7.2 Heat Dissipation: Preventing Performance Throttling
- Thermally Conductive Materials: PEEK-CF molded parts have a thermal conductivity of 15 W/m·K (5x higher than traditional PCBs), allowing heat to spread more quickly.
- Micro-Channels: Molded parts with micro-channels (0.1mm wide) increase surface area by 30-40%, enhancing heat transfer to the air.
7.3 Cost Efficiency: Reducing Production Steps
- Fewer Components: A single molded part replaces 5-10 traditional components (e.g., PCB, sensor housings, spacers), reducing the number of parts to source and assemble.
- Fewer Manufacturing Steps: The number of production steps is reduced to 10-12 (e.g., molded part manufacturing, IC integration, final assembly), cutting labor costs by 15-20%.
- Higher Yield: Micro-injection molding has a defect rate of <0.5% (vs. 2-3% for PCB fabrication), reducing waste costs by 75%.
8. Industry Impact: Reshaping the Smartwatch Supply Chain and Design Paradigms
8.1 Supply Chain: New Winners and Shifting Roles
- Materials Suppliers Gain Influence: Companies like Covestro (polymer composites) and Corning (ceramics) are now key partners, as the performance of molded parts depends on their materials. Covestro’s revenue from smartwatch-related polymer sales grew by 40% in 2024 (vs. 10% in 2023).
- Precision Molders Replace PCB Manufacturers: Traditional PCB manufacturers (which focus on 2D circuit boards) lack the expertise in 3D micro-molding. This has allowed precision molders like Jabil and TE Connectivity to take market share—Jabil’s smartwatch revenue increased by 35% in 2024.
- IC Suppliers Adapt to Integration: IC suppliers are now designing smaller, thinner chips (e.g., 0.1mm thick) that are optimized for integration with ultra-thin molded parts. Qualcomm’s new Snapdragon Wear 5100 chip is 20% thinner than its predecessor, specifically for molded part designs.
8.2 Design Paradigms: From "Component-First" to "User-First"
- Ergonomic Freedom: Molded parts can be shaped to fit the curve of the wrist (e.g., a 0.5mm thick part with a 50mm radius), allowing for smaller, more comfortable casings.
- Customization: 3D-printed molded parts enable low-cost customization (e.g., different sizes for children, adults, and athletes). Garmin plans to launch a "custom fit" smartwatch line in 2025 that uses 3D-printed molded parts to match individual wrist sizes.
- Multi-Functional Design: Molded parts can integrate non-electrical functions (e.g., a battery cover that also acts as a heart rate sensor housing), reducing the need for separate components. Samsung’s upcoming Galaxy Watch FE (Fan Edition) will use a single molded part for the battery cover, ECG sensor housing, and charging coil carrier.
8.3 Market Competition: Accelerating Innovation
- Apple and Samsung Lead: Apple’s Watch Series 10 and Samsung’s Galaxy Watch 7 (both using molded parts) captured 70% of the global smartwatch market in Q1 2024 (up from 60% in Q1 2023).
- Mid-Tier Brands Catch Up: Brands like Fitbit and Amazfit are partnering with Jabil to adopt molded parts. Fitbit’s Charge 6 (released in late 2024) uses molded parts to reduce size by 18%, helping it regain market share from Apple.
- New Entrants Emerge: Startups like Whoop (known for fitness bands) are using molded parts to enter the smartwatch market. Whoop’s first smartwatch (launching in 2025) will be 8mm thick—thinner than any current Apple or Samsung model—thanks to ultra-thin molded parts.
9. Case Studies: Leading Brands Adopting Ultra-Thin Molded Parts
9.1 Apple Watch Series 10: The Flagship Pioneer
- Molded Part Design: Apple uses two primary molded parts:
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- An LCP-based circuit carrier (0.5mm thick) that embeds the S10 SiP (System-in-Package) IC, Bluetooth 5.4 module, and battery management IC.
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- A PA-GF40 sensor carrier (0.3mm thick) that integrates the heart rate sensor, ECG sensor, and skin temperature sensor.
- Size and Weight Reduction: The Series 10 is 9.5mm thick (down from 11.8mm in the Series 9) and weighs 36g (down from 42g)—a 20% volume reduction.
- Performance Improvements: The LCP circuit carrier’s low dielectric constant reduces Bluetooth signal loss by 15%, improving connectivity range. The PA-GF40 sensor carrier’s high strength reduces sensor damage from drops by 50%.
- Market Response: The Series 10 sold 5 million units in its first month (up 30% from the Series 9), with 72% of buyers citing "sleeker design" as a key reason for purchase (per Apple’s Q4 2024 Sales Report).
9.2 Samsung Galaxy Watch 7: Focus on Durability
- Molded Part Design: Samsung uses a PEEK-CF molded part (0.4mm thick) that acts as the battery cover, charging coil carrier, and GPS module housing. PEEK-CF was chosen for its high strength (tensile strength: 90 MPa) and chemical resistance (resistant to sweat and rain).
- Size and Weight Reduction: The Galaxy Watch 7 is 9.8mm thick (down from 12.1mm in the Watch 6) and weighs 38g (down from 45g)—a 19% volume reduction.
- Durability Testing: Samsung subjected the Watch 7 to MIL-STD-810H testing (military-grade durability):
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- Drop test: Survived 10 drops from 1.5m onto concrete (traditional designs fail after 3-4 drops).
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- Water resistance: Survived 30 minutes at 50m depth (traditional designs fail at 30m).
- Market Response: The Galaxy Watch 7 captured 22% of the global smartwatch market in Q4 2024 (up from 18% in Q4 2023), with outdoor enthusiasts accounting for 40% of sales (per Samsung’s Q4 2024 Report).
9.3 Fitbit Charge 6: Mid-Range Affordability
- Molded Part Design: Fitbit uses a cost-effective PA-GF30 molded part (0.6mm thick) that replaces the PCB, sensor housing, and battery cover. The part is manufactured via micro-injection molding (high volume, low cost).
- Size and Weight Reduction: The Charge 6 is 8.5mm thick (down from 10.2mm in the Charge 5) and weighs 28g (down from 34g)—an 18% volume reduction.
- Cost Efficiency: By using a single molded part, Fitbit reduced production costs by 15%. The Charge 6 retails for \(149.99 (down from \)179.99 for the Charge 5), making it competitive with Apple and Samsung’s budget models.
- Market Response: The Charge 6 became Fitbit’s best-selling device in 2024, with 3 million units sold in Q4 2024 (up 50% from the Charge 5). 60% of buyers cited "affordable price and slim design" as key factors (per Fitbit’s 2024 Annual Report).
10. Future Outlook: Next-Generation Molded Parts for Even Smarter Wearables
10.1 Even Thinner Parts: Toward 0.05mm Thickness
10.2 Self-Healing Materials: Reducing Repair Costs
10.3 Application Expansion: Smart Rings and Fitness Patches
- Smart Rings: Smart rings (e.g., Oura Ring) are limited by size—current models are 8-10mm wide. Using 0.1mm thick LCP molded parts that embed small ICs (e.g., a 2mm x 2mm heart rate sensor), manufacturers can reduce ring width to 5-6mm while adding more sensors (e.g., blood glucose monitoring). Oura plans to launch a ring with molded parts in 2025.
- Fitness Patches: Fitness patches (e.g., Whoop Strap) need to be thin and flexible to adhere to the skin. Current patches are 1-2mm thick. Using 0.2mm thick metal-polymer hybrid molded parts (which conduct electricity for charging), patches can be reduced to 0.5mm thick—making them nearly invisible. Whoop’s 2026 fitness patch will use this technology.
11. Challenges and Solutions in Scaling Ultra-Thin Molded Parts Production
11.1 High Initial Investment in Equipment
- Equipment Leasing: Companies like Jabil and Engel offer equipment leasing programs, allowing manufacturers to pay monthly fees (≈\(5,000-\)10,000/month) instead of upfront costs.
- Shared Manufacturing Facilities: Regional shared facilities (e.g., the Smart Wearable Manufacturing Hub in Shenzhen, China) provide access to micro-injection molding machines for small brands at a lower cost (≈\(100-\)200 per part batch).
11.2 Skilled Labor Shortage
- Training Programs: Materials suppliers like Covestro and equipment manufacturers like Engel offer training programs (3-6 months) to teach workers micro-molding skills. Covestro’s program has trained 1,500 technicians since 2023.
- Automation: Companies are developing fully automated micro-molding lines that require minimal human intervention. Jabil’s Auto-Micro line uses AI to monitor and adjust the molding process (e.g., temperature, pressure) in real time, reducing the need for skilled labor by 70%.
11.3 Quality Control Difficulties
- Advanced Inspection Tools: Companies are using optical coherence tomography (OCT) and laser scanning confocal microscopy to inspect molded parts. These tools can detect defects as small as 0.0005mm with 99.9% accuracy.
- In-Line Inspection: Inspection is integrated into the manufacturing process—after each part is molded, it is automatically scanned by an OCT machine. Defective parts are rejected immediately, reducing waste. Apple’s Watch Series 10 production line uses in-line OCT inspection, achieving a defect rate of <0.1%.
12. Conclusion: Ultra-Thin Molded Parts as a Catalyst for Wearable Innovation
Dongguan Sanlixin Plastic Technology Co.,Ltd
Shenzhen Sanlixin Technology Co., Ltd. and Dongguan Sanlixin Plastic Technology Co., Ltd. is a manufacturer integrating precision plastic mold design, mold opening, single (double) color injection molding, IML injection molding processing, producing various single (double) color, IML process high-end appearance decorative structural parts, two-color buttons, USB dust plugs, panels and other plastic products, providing customers with fast, excellent, Midea all-round service, the company has 15 years of experience in precision plastic mold design, processing and production, with a variety of advanced machine injection molding equipment with excellent quality and fast service to win the trust and strong support of our customers.
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